China Semiconductor Industry and Application Expo (IC Expo) 2025

Date: Wed, Nov 5, 2025 – Fri, Nov 7, 2025

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China Semiconductor Industry and Application Expo (Shanghai) will be held from November 5 to 7, 2025, at the Shanghai New International Expo Centre. The exhibition covers chip design, wafer fabrication, advanced packaging, semiconductor equipment, materials, automotive semiconductors, AI chips, and compound semiconductors. Organized by CEIEC, the event enhances cooperation across the semiconductor ecosystem. It supports innovation, facilitates breakthroughs in core technologies, and strengthens industrial collaboration in China’s key semiconductor regions including the Yangtze River Delta and Greater Bay Area.

Range of Exhibition

Chip Design & Wafer Manufacturing:
IC design, chips, EDA tools, MCU, wafer manufacturing, processing equipment, components.
Advanced Packaging:
Chiplet, SiP, WLP, 3D packaging, PLP, TSV/TGV, substrates (organic/silicon/glass), IC carriers, packaging materials and tools.
Semiconductor Equipment & Components:
Lithography, etching, ion implantation, CVD/PVD, thinning, cleaning, bonding, dicing, sorting, testing, probing machines and accessories.
Materials & Carbon/Diamond Semiconductors:
Silicon wafers, photomasks, electronic gases, photoresists, CMP materials, targets, bonding wires, ceramic and packaging substrates, carbon materials, diamond semiconductors, superhard materials.
Compound & Third-Gen Semiconductors:
GaN, SiC, ZnO, diamond wafers and substrates, power and RF devices, epitaxy, IGBT materials and processing equipment.
Power & Automotive Semiconductors:
Automotive-grade controllers and chips, IGBT, MOSFET, SiC modules, power management ICs, automotive electronics packaging and testing.
Computing, AI & Co-Packaged Optics:
AI chips, computing solutions, storage, algorithm platforms, CPO modules, technologies, and devices.
Application Solutions & Integration:
Electronics in automotive, 5G, AI, IoT, industrial control, special applications, smart terminals, and embedded systems.

Target Audience

Semiconductor manufacturers, IC designers and engineers, wafer fabrication and packaging specialists, EDA software and AI-driven computing experts, automotive and power semiconductor professionals, IoT and 5G technology developers, research institutions and universities, policymakers and trade associations, electronics and communication engineers, supply chain managers, and international investors.

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Event Link

Official Website

Access

Free Access, Pre Registeration Required

Event Type

International Exhibtion

Language

Chinese, English

Avenue

Shanghai New International Expo Center

Address

No. 2345, Longyang Road, Pudong New Area, Shanghai, China 中国上海市浦东新区龙阳路2345号

Subway

Subway Line 2, Maglev Train, Longyang Road Station; Subway Line 7 Huamu Road Station (Exit 2)

Bus

Take bus lines 581, 746, 798, 975, 976, 989, 1023, Daqiao Line 6, Longdong Line, Longlu Line, Longgang Express Line, Longlin Line, Longda Line, and Longhui Line, get off at Longyang Road Subway Station, transfer to Metro Line 7, get off at Huamu Road Station, walk 100 meters to the Expo Center, or take the free shuttle bus from Longyang Road Subway Station to the Expo Center.