Shanghai International Semiconductor Expo 2026

Shanghai International Semiconductor Expo, held from June 3–5, 2026 at the Shanghai New International Expo Centre, focuses on semiconductor manufacturing, integrated circuits, materials, and third-generation semiconductor technologies. Covering an exhibition area of over 60,000 sqm, it gathers more than 1,200 exhibitors and 60,000 visitors from across the semiconductor industry. Organized by the China Semiconductor Industry Association and Shanghai Electronic Semiconductor Industry Alliance, the event features the entire semiconductor supply chain—from IC design, wafer fabrication, and packaging to SiC and GaN power devices. The exhibition aims to foster industry collaboration, accelerate technological innovation, and promote the integration of production, research, and application in China’s semiconductor ecosystem.

Range of Exhibition

• Semiconductor Equipment:
  Packaging, diffusion, welding, cleaning, testing, cooling, oxidation, polishing, lithography, etching, ion implantation, CVD/PVD systems, wafer thinning, slicing, dicing, bonding, reflow soldering, automation, robotics, machine vision, precision instruments, cleanroom systems, and water treatment equipment.
• IC Design:
  Chip and electronic product design, IC testing and instruments, design tools, manufacturing and packaging, EDA software, IP design, embedded systems, digital and analog circuit design, and fabless solutions.
• Wafer Fabrication & Packaging:
  Wafer production, advanced SiP packaging, OSAT, EMS/OEM, silicon wafers, IC substrates, PCB boards, testing and assembly equipment, and packaging design materials.
• Integrated Circuit Manufacturing:
  Foundries, wafer fabs, analog and digital IC production, mixed-signal ICs, terminal circuit manufacturing, and system integration.
• Packaging & Testing Solutions:
  Probers, probe cards, testers, bonding wires, lead frames, encapsulation materials, adhesives, lamination substrates, automation testing, and precision laser cutting.
• Third-Generation Semiconductors:
  SiC and GaN substrates and devices, wafer fabrication, testing, optoelectronic components (LEDs, lasers, detectors), power electronics (MOSFETs, IGBTs, HEMTs), and RF/microwave devices.
• Semiconductor Materials:
  Silicon wafers, germanium-silicon materials, SOI materials, quartz and graphite products, photoresists, photomasks, CMP materials, electronic gases, solder materials, adhesives, ceramic substrates, encapsulation materials, and polishing films.
• Electronic Components:
  Resistors, capacitors, transistors, connectors, sensors, PCBs, inductors, power supplies, passive components, displays, diodes, relays, transformers, and materials for 5G, IoT, and automotive electronics.

Target Audience