World Semiconductor Conference and Expo will be held from June 20 to 22, 2025 at the Nanjing International Expo Center. It covers semiconductor design, wafer fabrication, packaging and testing, equipment and materials, and terminal applications. Over 300 exhibitors and 30,000 visitors are expected across 18,000 sqm. Organized by Nanjing Runzhan International Exhibition Co., Ltd., the event includes 20+ forums focused on AI, automotive electronics, chip applications, and talent exchange. It connects global industry leaders with upstream and downstream enterprises to foster collaboration and innovation across the semiconductor value chain.
Range of Exhibition
- Semiconductor Design:
IC design, EDA tools, design services, layout and verification technologies.
- Semiconductor Manufacturing:
Wafer fabrication, foundry services, cleanroom technology, lithography, photomask production.
- Packaging & Testing:
Chip packaging solutions, testing equipment, inspection systems, reliability and failure analysis.
- Equipment & Materials:
Deposition systems, etching tools, silicon wafers, photomasks, bonding materials, chemicals.
- Third-Generation Semiconductors:
GaN and SiC devices, high-power and high-frequency components, wide bandgap technologies.
- Terminal Applications:
Smartphones, automotive electronics, industrial IoT, smart home, AI chips and modules.
- “Little Giant” Enterprises:
High-growth semiconductor SMEs with core innovation capabilities.
- IC Science Popularization:
Education exhibits on chip basics, semiconductor history, and tech evolution.
- Talent Exchange Programs:
Exhibits for the “Young Talents” and “Elite Program” promoting academic-industry collaboration and graduate recruitment.
Target Audience
IC design engineers, semiconductor manufacturers, electronics R&D experts, supply chain managers, equipment and materials suppliers, AI developers, automotive electronics engineers, academic researchers, investors, semiconductor industry associations