Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) 2025
Date: Wed, Sep 10, 2025 – Fri, Sep 12, 2025
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7th Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) will be held from September 10 to 12, 2025 at Shenzhen World Exhibition and Convention Center. Covering chip design, semiconductor equipment, advanced packaging, materials, and AI computing, the event will gather 900+ exhibitors, attract 50,000+ visitors, and span 60,000 sqm. Organized by the CIOE Organizing Committee, the expo highlights innovation across the entire semiconductor supply chain. Running concurrently with the China International Optoelectronic Expo, it enables synergy between photonics and semiconductors, aiming to foster cross-sector collaboration and promote downstream market growth.
Range of Exhibition
- Semiconductor Equipment:
Thermal annealing furnaces, etching machines, ion implanters, film deposition equipment, lithography machines, dicing saws, wire bonders, die bonders, grinding machines, inspection/test instruments, failure analysis tools, laser equipment, contamination control systems, and cleaning systems. - Semiconductor Materials:
Silicon wafers, compound semiconductors, CMP pads, photo masks, sputtering targets, etching liquids, bonding wires, substrates, photoresists, ultra-pure water, specialty gases, and high-performance plastics. - Advanced Packaging:
Flip-chip, wafer-level, 2.5D/3D, bump, fan-out packaging, related materials, design, testing, and manufacturing equipment. - Chip and IC Design:
IC design, EDA tools, storage chips, CPUs, analog/digital chips, DSPs, power management ICs, RF and driver ICs, and sensors. - AI Computing:
AI chips, computing servers, power systems, liquid cooling, and AI-related data infrastructure. - Semiconductor Core Components:
Robotics, sensors, precision parts, valves, RF components, quartz parts, gauges, pumps, stepper motors, filters, ceramic elements, electrostatic chucks, and motion control units. - Wide Bandgap Semiconductors & Power Devices:
SiC, GaN, Ga₂O₃, diamond, AlN, power devices (MOSFET, IGBT, HEMT), microwave RF components (MMIC), optoelectronic components (LED, LD, photodetectors), and substrates.
Target Audience
Semiconductor engineers, IC designers, electronics R&D teams, procurement professionals, manufacturing managers, investors, supply chain professionals, packaging/testing experts, academic researchers, government and association representatives.
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