Shenzhen International Semiconductor Expo 2026

Shenzhen International Semiconductor Expo will be held from June 10 to 12, 2026 at the Shenzhen World Exhibition & Convention Center. The exhibition showcases semiconductor equipment, wafer manufacturing, IC design, testing, packaging, materials, and third-generation semiconductors. It will host over 1,200 exhibitors and attract more than 50,000 professional visitors across a 60,000 m² exhibition space. Backed by key national authorities and industry stakeholders, the event aims to strengthen the domestic chip supply chain, promote innovation, and facilitate one-on-one procurement matchmaking. Media coverage by over 100 top-tier outlets will enhance exhibitor visibility.

Range of Exhibition

• Semiconductor Equipment & Smart Manufacturing:
  Packaging machines, photolithography systems, etching machines, bonding machines, reflow soldering, robots, vision systems, test equipment, cleanroom solutions.
• Wafer Fabrication & Packaging:
  Wafer manufacturing, advanced packaging (SiP, OSAT, EMS), IC substrates, PCB, OEM solutions, EDA tools.
• Testing & Packaging Materials:
  Probes, probe cards, bonding wires, test equipment, cutting fluids, adhesives, encapsulation materials, graphite, SiC.
• IC Design & EDA:
  IC product design, embedded software, EDA, digital and analog circuit design, IP design, fabless solutions.
• Integrated Circuits:
  Analog/digital/mixed-signal ICs, wafer foundries, IC end-products.
• Semiconductor Materials:
  Silicon wafers, GaN, SiC, SOI materials, photomasks, quartz, bonding agents, photoresist, wet chemicals, sputtering targets.
• Third-Generation Semiconductors:
  SiC, GaN, substrates, power devices, RF components, LED, lasers, detectors, MOSFETs, HEMTs.
• Electronic Components:
  Resistors, capacitors, transistors, connectors, transformers, PCBs, crystal components, sensors, power supplies, passive devices, EMI filters, 5G components.

Target Audience

Semiconductor manufacturers, electronics engineers, hardware R&D personnel, procurement officers, chip designers, packaging and testing professionals, automation solution providers, OEM/ODM companies, industry investors, academic and research institutions