Osaka Adhesion and Bonding Expo 2026
Date: Wed, May 13, 2026 – Fri, May 15, 2026
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10th Adhesion and Bonding Expo will be held May 13–15, 2026 at INTEX Osaka. The exhibition covers industrial adhesive agents, bonding materials, joining equipment and technologies including welding, friction stirring, ultrasonic and diffusion bonding, as well as dissimilar material joining technologies. The event welcomes over 25,000 professional visitors. Organized by RX Japan Ltd., it is held twice a year in Osaka and Tokyo as part of Highly-Functional Material Week, which consists of seven specialized exhibitions for advanced materials and equipment. The expo enables business negotiations, equipment demonstrations, and technical knowledge exchange for professionals seeking industrial adhesion and bonding solutions.
Range of Exhibition
- Adhesive Materials & Films:
Adhesive materials, adhesive films and tapes. - Joining & Bonding Equipment:
Joining equipment and bonding technologies. - Surface Preparation Technologies:
Surface treatment equipment. - Testing & Analysis Solutions:
Testing, measurement and analysis technologies. - Engineering & Simulation Tools:
Design simulation tools.
Target Audience
Automotive manufacturers, electronics manufacturers, construction companies, adhesive material suppliers, welding engineers, production engineers, R&D professionals, materials scientists, quality control specialists, industrial equipment manufacturers.Related Events
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