Asia Electronics Manufacturing and Microelectronics Industry Expo 2026

Date: Tue, Oct 27, 2026 – Thu, Oct 29, 2026

Asia Electronics Manufacturing and Microelectronics Industry Expo (NEPCON ASIA) will take place October 27–29, 2026 at the Shenzhen World Exhibition & Convention Center. Exhibits cover SMT equipment, semiconductor packaging, industrial automation, robotics, electronic materials, and testing solutions. With 3,500+ exhibitors, 165,000+ visitors, and 160,000 sqm exhibition space, the event is hosted by RX (Reed Exhibitions). It targets sourcing needs of 10,000+ new buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy manufacturing. Highlights include live demonstrations, full-process packaging lines, and themed matchmaking for smart manufacturing.

Range of Exhibition

  • SMT & Assembly Technology: SMT machines, screen printers, packaging tools, component feeders, insertion machines, assembly tools, line equipment.
  • Soldering & Cleaning Equipment: Soldering machines, rework tools, soldering robots, smoke purification systems, tin dross recyclers, cleaning solutions.
  • Inspection & Testing Equipment: AOI, SPI, X-Ray, ICT, PCB inspection systems, microscopes, 2D/3D inspection, environmental and functional testers.
  • Dispensing & Coating Equipment: Dispensing machines, conformal coating systems, injection devices, spraying equipment.
  • Electronic Materials & ESD Protection: Solder materials, adhesives, cleaning agents, conductive materials, anti-static materials and equipment.
  • Auxiliary SMT Solutions: Barcoding, IC programming, UV curing, warehouse automation, laser processing, sub-contracting services.
  • Industrial Robots: SCARA, Delta, articulated robots, cleanroom robots, Cartesian robots.
  • Motion Control Systems: Servo motors, PLCs, SCADA, embedded systems, industrial PCs, fieldbus networks.
  •  Machine Vision & Sensors: Industrial cameras, lenses, lighting systems, image processors, distance, temperature, and flow sensors.
  • Pneumatic & Mechanical Components: Bearings, slide rails, couplings, actuators, valves, vacuum components, air filters, silencers.
  • Automation Components: HMI panels, transformers, connectors, breakers, industrial fans, mounting systems.
  • System Integration & Smart Manufacturing: Automated storage, material handling, robotic arms, assembly and test automation, jigs and fixtures.
  • Software & IT for Automation: MES, ERP, SCM, PLM, DFM software, NPI solutions.
  • PCBs: Rigid boards (single/double/multilayer), flexible boards, rigid-flex boards, package substrates.
  • PCB Production Materials: Copper-clad laminates, copper foils, prepregs, etching chemicals, inks, films.
  • Specialized Production Equipment: Drilling, plating, surface treatment, screen printing, forming, routing, packaging automation.
  • Packaging Equipment: Equipment for electronic packaging and logistics automation.
  • Green Processing & Environmental Tech: Eco-friendly treatment systems, recycling solutions, clean manufacturing technology.

Target Audience

Electronics manufacturers, SMT engineers, automation system integrators, procurement heads, PCB designers, semiconductor packaging technicians, factory managers, industrial automation experts, R&D teams, electronics sourcing specialists
Area
160000 sqm
Exhibitors
3500+
Audience
165000+
Access
Free Access
Certified
UFI Certified
Event Type
International Exhibtion
Event Link
Language
Chinese, English
Address
No. 1, Zhancheng Road, Fuhai Street, Baoan District, Shenzhen, China 深圳市宝安区福海街道和平社区展城路1号
Subway
Subway Line 20: China International Exhibition Center Station, Exit C1/C2, arrive at the South Registration Hall
Bus
B892, M515; Exhibition and airport shuttle bus

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