Lopec

LOPEC International Flexible, Organic and Printed Electronics Exhibition and Conference 2026

Date: Tue, Feb 24, 2026 – Thu, Feb 26, 2026

LOPEC International Flexible, Organic and Printed Electronics Exhibition and Conference will be held from February 24–26, 2026 at the Internationales Congress Center Messe München (ICM) in Munich, Germany. The exhibition covers printed electronics, materials, manufacturing processes, assembly and packaging, system integration, inspection and test systems, devices, and applications. The event hosts about 160 exhibitors and around 2,000 visitors. Organized by Messe München GmbH, LOPEC brings together industry and research participants to exchange knowledge, review technologies, and explore applications in flexible, organic, and printed electronics. Previous editions gathered global participation, including 169 exhibitors from 29 countries and 2,331 visitors from 43 countries.

Conference Themes & Discussion Topics

Conference Structure: Technical Conference, Scientific Conference, Business Conference, Short Courses, and Application Sessions.

Key Topics Include:

  • Bio-based and functional materials
  • Manufacturing, slot-die processes, and process control
  • System integration and scalable production
  • Smart textiles, wearables, and healthcare applications
  • Robotics, HMI, and user interfaces
  • Energy generation, storage, and printed batteries
  • Circular economy and green electronics
  • AI and digital transformation in printed electronics
  • Automotive and mobility applications
  • Medical and environmental sensors
  • Business models, markets, and product developments

Program Highlights:
Plenary sessions, poster sessions, panel discussions on business model innovation, student poster awards, and the LOPEC Award Show & networking events

Range of Exhibition

  • Printed Electronics and Devices: Printed electronic components, circuits, and functional devices.
  • Materials: Functional inks, substrates, encapsulation materials, and specialty materials.
  • Manufacturing and Processing: Manufacturing processes, scalable production, and process control.
  • Assembly and Integration: Assembly, packaging technology, and system integration solutions.
  • Inspection and Testing: Inspection, quality control, and test systems.
  • Applications: Wearables, smart textiles, healthcare, mobility, energy, and smart living applications.

Target Audience

Electronics manufacturers, materials suppliers, R&D professionals, engineers, product developers, system integrators, startups, investors, academic researchers, technology consultants.
Exhibitors
160+
Audience
2000+
Access
Paid Ticket, Pre Registeration Required
Certified
FKM, UFI Certified
Event Type
Conference, International Exhibtion
Event Link
Language
English, German
Address
Messegelände, 81823 Munich, Germany Messegelände, 81823 München, Deutschland
Subway
Messestadt West / Messestadt Ost (U2 line)
Bus
Messe München Station

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