IICIE International Integrated Circuit Innovation Expo 2026

IICIE International Integrated Circuit Innovation Expo will be held from September 9–11, 2026 at the Shenzhen World Exhibition & Convention Center. The expo covers IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, key materials, and core components. Featuring over 900 exhibitors, 50,000+ professional visitors, and a 60,000 sq.m exhibition area, the event connects IDM, Fabless, Foundry, and OSAT enterprises with downstream sectors including AI, consumer electronics, automotive, communications, displays, optoelectronics, and new energy. Co-located with the 27th China International Optoelectronic Exposition (CIOE), it supports cross-industry collaboration, technology exchange, and full supply-chain integration to strengthen semiconductor innovation and industrial competitiveness.

Range of Exhibition

• Wafer Manufacturing & Foundry:
  Wafer fabrication and foundry services, manufacturing and metrology equipment, substrates, process materials, consumables, and core components.
• Compound Semiconductors & Power Devices:
  SiC, GaN, wide-bandgap materials, power devices and modules, automotive chips, manufacturing, packaging, and testing equipment.
• IC Design, Packaging & Testing:
  IC chips, EDA and IP services, fabless design, OSAT services, advanced packaging, testing equipment, packaging materials, AI computing solutions.
• Semiconductor Equipment:
  Manufacturing, packaging, inspection and testing equipment, assembly systems, environmental control systems, factory automation and robotics.
• Semiconductor Materials & Core Components:
  Substrate and packaging materials, precision components, seals, bearings, power supplies, motors, pumps, valves, sensors, machine vision, and motion control systems.

Target Audience

IDM and fabless companies, wafer foundries and OSAT providers, semiconductor equipment and material suppliers, chip designers and EDA providers, AI and computing companies, consumer electronics manufacturers, automotive and new energy enterprises, communications and data center operators, research institutes and universities, industry investors and integrators.