Shenzhen International Electronic Circuits Expo (HKPCA Show) 2026

Shenzhen International Electronic Circuits Expo (HKPCA Show) will be held from December 2 to 4, 2026, at the Shenzhen World Exhibition & Convention Center in Bao’an. The exhibition covers PCB products, advanced PCB manufacturing equipment, electronic assembly technologies, intelligent manufacturing solutions, packaging and testing technologies, and related materials and chemicals. The event gathers leading industry companies and professionals across the global PCB and electronics supply chain. Organized by the Hong Kong Printed Circuit Association, the show focuses on AI-driven innovation, high-performance computing demand, and advanced PCB technologies, helping visitors identify technology upgrades, production efficiency improvements, and strategic opportunities in the AI era.

Range of Exhibition

• PCB Applications:
  Automotive electronics, telecommunications equipment, computers and peripherals, consumer electronics, aerospace and defense, industrial and medical electronics, software-related applications.
• Printed Circuit Boards:
  HDI PCBs, IC substrate and packaging boards, rigid single-sided and multilayer boards, rigid-flex PCBs, flexible PCBs, connector PCBs, advanced and specialty boards.
• PCB Manufacturing & Automation Equipment:
  PCB CAD/CAM systems, imaging and circuit design, lamination, CNC drilling and laser drilling, plating and electroplating, automation and robotics, AOI/AVI inspection, surface finishing, solder mask printing, electrical and reliability testing, packaging processes.
• Environmental & Clean Technologies:
  Green manufacturing solutions, water treatment and recycling systems, cleanroom equipment, waste recycling systems, cleaning and fume treatment equipment.
• PCB Materials & Chemicals:
  Copper foil, resin systems, laminates, fiberglass and carbon fiber materials, dry films and photoresists, plating and surface treatment chemicals, inks, solder masks, drilling tools.
• Electronic Assembly Technologies:
  Design and testing services, contract manufacturing, compliance services, SMT equipment, placement and assembly systems, soldering and reflow equipment, inspection and rework systems.
• Smart Manufacturing & AI Solutions:
  AI industrial models, intelligent software applications, industrial robots, smart PCB production solutions, intelligent logistics and warehousing, industrial IoT, ERP and MES systems, sensors and intelligent control components.
• Packaging & Testing Technologies:
  IC packaging, semiconductor packaging, advanced packaging technologies, IC and semiconductor testing solutions.
• Precision Components & Parts:
  Controllers, connectors, switches, lasers, optical components, valves and pumps, mechanical parts, precision electronic components.

Target Audience

PCB manufacturers, electronics OEMs, semiconductor companies, automotive electronics suppliers, telecom equipment manufacturers, consumer electronics brands, industrial and medical electronics firms, manufacturing engineers, R&D professionals, supply chain managers.