Shenzhen Semiconductor Industry Ecosystem Expo (SEMIBAY) 2026

Shenzhen Semiconductor Industry Ecosystem Expo (SEMIBAY) will be held from October 14 to 16, 2026 at Shenzhen Convention and Exhibition Center, hosted by the Shenzhen Semiconductor and IC Industry Association (SICA). This major semiconductor exhibition will gather over 400 leading companies across wafer manufacturing, packaging and testing, compound semiconductors, automotive-grade chips, EDA software, and design services, covering a total area of 40,000 square meters. With more than 40,000 professionals expected to attend, the expo creates a powerful platform for collaboration and innovation in the semiconductor ecosystem, helping bridge the supply chain, capital flow, talent development, and technology exchange both domestically and globally.

Range of Exhibition

• Wafer Manufacturing: Wafer processing equipment, cleanroom systems, materials, subsystems, components, consumables, and services from wafer fabs and integrated device manufacturers (IDMs).
• Packaging and Testing: Semiconductor testing equipment, packaging materials, subsystems, components, consumables, and testing service providers.
• Compound Semiconductors: Silicon carbide, gallium nitride, gallium arsenide materials, RF and high-power semiconductor devices, and new energy power components.
• Automotive Semiconductors: Automotive-grade IGBT, SiC, GaN power semiconductors, MCUs, ECUs, domain controllers, smart cockpit and ADAS chips, autonomous driving systems, and automotive storage and computing chips.
• EDA/IP and Design Services: Electronic design automation software, process control tools, chip design IP services, Chiplet and advanced packaging design services, AI-driven cloud design platforms, and consulting.

Target Audience

Chip manufacturers, semiconductor equipment suppliers, materials providers, design service firms, automotive electronics companies, R&D engineers, industry investors, procurement managers, tech consultants, academic researchers.