Germany International Bonding Technology Trade Fair Bondexpo 2026

18th Germany International Bonding Technology Trade Fair Bondexpo (6–8 October 2026) at Messe Stuttgart focuses on the joining and bonding process chain including adhesive bonding, potting, sealing, and foaming, offering system solutions for current and future bonding challenges across multiple materials. The event hosts 500 exhibitors and attracts around 20,000 visitors. Organized by P.E. Schall GmbH & Co. KG, it supports visitors in finding solutions for resource conservation, material mix/hybrid designs, lightweight construction, and miniaturization for microsystem technology.

Range of Exhibition

• Digital & Process Technologies: Digital technologies, AI, maintenance tools, cybersecurity.
• Assembly & Production Systems: Assembly systems, assembly planning, material feeding, handling, robotics.
• Joining & Machining: Assembly, joining, and machining technologies.
• Quality & Inspection: Measuring, testing, inspection, and quality assurance.
• Automation & Visual Systems: Automation, image processing, sensor technology, analysis tools/software.
• Production Support & Packaging: Production peripherals, packaging, and related equipment.
• Industry Services & Education: Associations, specialist communication, education and training, and service providers.

Target Audience

Production engineers, process engineers, R&D managers, quality assurance specialists, procurement professionals, manufacturing executives, system integrators, material scientists, automation specialists, technical consultants.