China Semiconductor Equipment, Core Components and Materials Expo (CSEAC) 2026

14th Semiconductor Equipment, Core Components and Materials Expo (CSEAC) will be held from June 10 to 12, 2026 at Wuxi Taihu International Expo Center. The exhibition will showcase semiconductor manufacturing equipment, core components, advanced materials, and intelligent manufacturing solutions. With participation from leading exhibitors and thousands of professional visitors, the event spans a large exhibition area and is organized by top industry bodies. Visitors attend to explore new technologies, expand business networks, and capture emerging opportunities in the semiconductor supply chain.

Range of Exhibition

• Semiconductor Manufacturing Equipment: Wafer fabrication equipment, lithography machines, etching systems, cleaning systems, ion implantation, testing and measurement devices.
• Core Components: Precision optics, vacuum components, power modules, sensors, pumps, valves, robotics systems.
• Materials: Silicon wafers, photoresists, specialty gases, electronic chemicals, packaging materials, advanced substrates.
• Packaging & Testing: Assembly equipment, testing instruments, reliability solutions, failure analysis tools.
• Intelligent Manufacturing Solutions: Automation systems, smart factory solutions, industrial software, data management platforms.

Target Audience

Semiconductor manufacturers, wafer fabrication plants, packaging and testing companies, equipment suppliers, materials providers, R&D institutes, academic researchers, electronic component manufacturers, investors, government and industry associations.