Shenzhen International Electronics Expo (ELEXCON) 2026

Shenzhen International Electronics Expo (ELEXCON) will take place from August 25-27, 2026, at Shenzhen Convention and Exhibition Center (Futian), Halls 1 and 9. This premier event will bring together leading global brands to showcase the full electronics industry chain, offering a comprehensive platform for innovation display, procurement, and technical exchange. Featured technologies include integrated circuits, embedded systems, power management and power devices, electronic components, OSAT packaging services, Chiplet heterogeneous integration, 3D IC design, EDA tools, IC substrates, advanced materials, and semiconductor manufacturing equipment. Accompanying the exhibition will be a series of technical forums presenting global industry trends and emerging technologies.

Range of Exhibition

• Semiconductor and 5G Technology Pavilion: Featuring semiconductors, 5G technologies, automotive-grade semiconductor components, connectors, switches, MEMS, sensors, and distributor e-commerce platforms.
• Power and Energy Storage Technology Pavilion:
  Focusing on power management, power devices, third-generation semiconductors, PD fast-charging technology, batteries, energy storage solutions, and power testing equipment.
• Embedded and AIoT Technology Pavilion: Highlighting embedded processors and MCUs, RISC-V technology, memory solutions, AI technologies, industrial computers, board and panel displays, and IoT solutions.
• SiP and Advanced Packaging Pavilion: Showcasing advanced equipment and processes, EDA tools, OSAT packaging services, wafer-level SiP advanced production lines, advanced materials, international material brands, and Mini-LED technology.

Target Audience

Industry professionals, engineers, designers, embedded system developers, power management experts, semiconductor manufacturers, electronics supply chain specialists, procurement managers, IoT solution providers, AI researchers, industrial automation professionals.