Shanghai High-Speed Communication and Electronic Design Expo 2025

Exhibition Introduction

4th High-Speed Communication and Electronic Design Expo 2025 will be held from October 20 to 22, 2025, at the Shanghai World Expo Exhibition & Convention Center in Hall 3. Organized by EDWTech, this specialized event serves as a leading platform for global academic, technical, and industrial innovation exchange, focusing on cutting-edge solutions for 5G/6G wireless communication, IoT, artificial intelligence, new energy vehicles, smart home systems, connected healthcare, aerospace, satellite communications, and semiconductor applications. The expo will feature advanced technologies and products including signal and power integrity tools, system design, modeling and simulation, RF and microwave technologies, PCB materials and processing, EMC/EMI solutions, AI components, connectors, cables, 5G antenna design and testing, as well as robotics applications. Over three days, industry leaders, R&D teams, and decision-makers will gather to explore future-ready technologies designed to meet the growing demand for wireless infrastructure, electronic systems, and next-generation devices.

Range of Exhibition

• Signal and Power Integrity:
  Solutions for maintaining high-speed signal quality and reliable power delivery in electronic systems.
• System Design, Modeling, and Simulation:
  Advanced design methodologies, virtual prototyping, and simulation software for electronic hardware and systems.
• Test and Measurement:
  Precision measurement instruments, testing tools for electronic devices, RF systems, and high-frequency components.
• RF and Microwave:
  Technologies for wireless communication systems including microwave circuits, antennas, and signal processing tools.
• PCB Materials and Processing:
  High-performance printed circuit board materials, fabrication techniques, and advanced surface treatments.
• Electromagnetic Compatibility (EMC) and Interference (EMI):
  Shielding materials, noise suppression solutions, and interference management systems.
• Artificial Intelligence:
  AI-powered chipsets, embedded solutions, machine learning accelerators, and edge computing platforms.
• Connectors and Cables (5G):
  High-speed connectors, next-generation cables, and interconnection solutions for 5G networks and devices.
• Internet of Things (IoT):
  Smart modules, wireless IoT solutions, data processing frameworks, and embedded devices for IoT ecosystems.
• I/O Interface Design:
  Innovative input/output interface architecture, signal conversion modules, and high-speed connectors.
• 5G Antenna Design and Testing:
  Advanced antenna systems, testing tools, and measurement solutions for 5G network deployment and optimization.
• Robotics:
  Autonomous systems, robotic arms, embedded control units, AI-driven robotics applications, and motion sensors.

Target Audience

Electronics engineers, system architects, wireless communication experts, PCB and circuit designers, hardware R&D professionals, AI developers, IoT solution providers, semiconductor manufacturers, aerospace communication specialists, test and measurement engineers.